As advanced nodes like 16–18nm become the new standard, analog teams are often tied up maintaining legacy designs on 180nm, 130nm, or 65nm. With foundries phasing out older processes, transitioning is necessary, but it demands time, budget, and talent that could be better focused on newer technologies.
Technical Challenges in Analog Design Migration
Migrating analog and mixed-signal designs to advanced nodes like 16-18nm introduces several complexities that can impact yield, reliability, and performance such as:
• Process variations and device mismatch
Finer nodes amplify statistical variations in threshold voltage (Vt), mobility, and oxide thickness, leading to increased mismatch in transistors. This can degrade precision in circuits like op-amps, ADCs, or RF front-ends.
• Parasitic effects and layout-dependent effects
Smaller geometries exacerbate resistance in interconnects and capacitance coupling parasitics, requiring advanced modeling for electromigration, IR drop, and noise. Layout effects like well proximity or stress-induced mobility changes become more pronounced.
• Power and voltage scaling issues
Legacy designs often operate at higher voltages such as 1.8V+, but 16-18nm nodes demand lower supplies (0.8V), necessitating redesigns for headroom in analog blocks while maintaining signal integrity and ESD protection.
• Verification and simulation demands
Mixed-signal verification flows must handle increased complexity from double-patterning lithography and multi-Vt libraries, often requiring Monte Carlo simulations for variability or EM/IR analysis tools.
By addressing these explicitly, Triple Crown shows empathy for the audience’s pain points, backed by industry insights.
Our Solution
Triple Crown acts as a strategic engineering partner to help you move forward without losing momentum. We take ownership of your legacy workloads, handling:
• Sustaining engineering and bug triage
Using version control with Git and Jira for tracking, combined with Spectre or HSPICE simulations for root-cause analysis of issues like flicker noise or mismatch
• Legacy verification flows
Automated scripts in Python/Skill for regression testing, incorporating EM/IR checks with Calibre or StarRC, and variability analysis via Monte Carlo or worst-case corner simulations.
• Custom PDK adaptation and migration documentation
Expertise in porting to TSMC/GlobalFoundries 16-18nm PDKs, including device retargeting, rule decks for double-patterning, and AI-driven tools, similar to Synopsys’ solutions, for rapid schematic-to-layout migration.
This lets your internal teams focus on new-node designs while we maintain continuity, compliance, and performance on older nodes.
Expert Engineering Support
We leverage industry-standard EDA flows and cutting-edge methodologies to ensure seamless migration by working seamlessly across legacy and modern nodes, helping you reduce power, die size, and cost, while boosting performance and integration.
Our team includes:
• Analog/Mixed-Signal & RFIC engineers
With 15+ years in FinFET designs, specializing in low-noise amplifiers, PLLs, and SERDES, using tools like ADS for RF simulation.
• Layout and verification specialists
Proficient in floorplanning for LDE mitigation and DRC/LVS with Mentor Graphics or Cadence environments.
• PDK migration experts
Experienced in foundry transitions, including custom cell library development and parasitic extraction for sub-20nm nodes.
Why It Matters
Our clients see real benefits when offloading legacy engineering to Triple Crown such as:
• Cost Efficiency – Lower immediate production costs and improve lifecycle economics.
• Improved Performance and Power Efficiency – Optimize systems by reducing power consumption while boosting performance.
• Reduced Die Size and Better Integration – Fit more transistors in smaller areas for smarter, more compact designs.
• Enhanced PPA (Performance, Power, Area) – Achieve better technical outcomes across all key dimensions.
• Increased Engineering Capacity – Free internal teams for strategic, next-gen initiatives.
• Faster Time-to-Market – Accelerate delivery of next-generation silicon.
• Stronger ROI – Sustain revenue from legacy products while advancing new platforms.
Looking Ahead
With foundries continuing to phase out support for older nodes and increasing pressure to consolidate into smaller, more integrated dies, the migration trend is only accelerating.
As nodes shrink below 16nm, challenges like quantum effects, self-heating in FinFETs, and integration with digital SoCs will intensify.
• Scaling to 7nm+ with gate-all-around for better electrostatic control in analog devices.
• Incorporating AI/ML for predictive modeling of variations, reducing design iterations by up to 50%.
• Ensuring compatibility with advanced packaging like 2.5D/3D ICs for heterogeneous integration in RF and sensor applications.
Design managers across aerospace, automotive, RF communications, and defense are already taking action to stay ahead.
If you’re exploring ways to reduce die size, improve power efficiency, or future-proof your designs, connect with us at info@tripleco.com to book a session with our experts.